Heat Transfer Calculation Of Finned Microchannel

The fins forming the microchannel are processed together with the heat-absorbing substrate, and the existence of fins can significantly enhance the heat transfer effect of the microchannel. Because the flow section of the microchannel is very small, the heat transfer coefficient in the microchannel is very high, which can greatly improve the heat dissipation. With water as the heat transfer medium, the heat flow density of the microchannel substrate can be as high as 50 W/cm2, and the temperature difference of the heat-absorbing surface of the substrate can be less than 1 ℃, which is especially suitable for the heat dissipation of components requiring high heat flow density and high temperature.
The microchannel radiator is generally made of silicon or copper, and the thickness of the substrate is generally 2 mm. The thickness of the fin is about 1 mm. The height of the fin, that is, the height of the microchannel, can be appropriately higher, which can be taken as 5 - 10 mmo. Because the width of the channel is very small, the surface of the substrate in contact with the electronic components needs to have a very high flatness, so it needs to be processed and manufactured by special processes.